The 5th Glass Substrate TGV & Advanced Packaging Industry Chain Summit Forum
1. Conference Background As Mo…
半导体产业资源汇总
半导体产业资源汇总
先进封装HDAP（High Density Advanced Package)；FOWLP、2.5D/3D、小芯片以及直接和混合键合等高密度先进封装 (HDAP) 的发展正在引发传统 IC 设计和 IC 封装设计领域的融合；The growth of High Density Advanced Packages (HDAP) such as FOWLP, 2.5D/3D, chiplets and direct and hybrid bonding is triggering a convergence of the traditional IC design and IC package-design worlds.
1. Conference Background As Mo…
新都技研（SHINDO）于3日宣布，将凭借TGCV（玻璃陶瓷…
2026年8月20日，长电科技（600584.SH）公布了2…