Translation: [Invitation] The 5th Ceramic Substrate and Packaging Industry Forum (June 12, 2025 · Suzhou)

Hotel Nikko Suzhou

Address: 368 Changjiang Road, Huqiu District, Suzhou City

With the rapid development of modern science and technology, especially electronic information technology, microelectronic devices are evolving towards large-scale integration, miniaturization, high efficiency, and high reliability. Particularly, the emergence and application of third-generation semiconductor devices (such as SiC and GaN) have led to increased integration of electronic systems, resulting in higher power density. Consequently, the heat generated by electronic components and systems during operation increases, leading to higher system operating temperatures. This causes deterioration in semiconductor device performance, including device failure, delamination, and even the burning of packaging materials. Therefore, it has become urgent to research and develop new packaging materials with high thermal conductivity and good overall performance.

Ceramic substrates have excellent insulation properties, high reliability, low dielectric constant, good high-frequency characteristics, small thermal expansion coefficient, low thermal mismatch rate, high thermal conductivity, good airtightness, stable chemical performance, good corrosion resistance, and are not prone to micro-cracking. These qualities essentially meet all the performance requirements of microelectronic device packaging and are widely used in fields such as automotive electronics, rail transit, energy storage photovoltaics, aerospace, and military engineering.

Ceramic substrates consist of a ceramic base and a metal wiring layer. The metal wiring is created by sputtering, evaporative deposition, or printing various metal materials onto the ceramic base to fabricate thin-film and thick-film circuits. Commonly used electronic packaging ceramic substrate materials include beryllium oxide (BeO) and alumina ceramics (Al2O3).2O3Zirconia-toughened alumina (ZTA), aluminum nitride ceramics (AlN), and silicon nitride ceramics (Si3N4).3N4and silicon carbide ceramics (SiC), etc.; there are many methods for metallizing ceramic substrates. Based on the packaging structure and application requirements, ceramic substrates can be divided into two main categories: planar ceramic substrates and multilayer ceramic substrates. According to the process, they are classified into DPC, DBC, AMB, DBA, TPC, TFC, LTCC, HTCC, etc.

As the power consumption of electronic devices increases, the trend towards higher integration and miniaturization becomes more prominent, and frequencies continue to rise, there is a need for packaging products with higher heat dissipation effects, denser wiring circuits, and lower losses. In terms of materials, nitride ceramics, which have superior thermal conductivity and mechanical properties, are gradually becoming the main heat dissipation materials for electronic devices. In terms of processes, thick-film substrates combined with thin-film technology are used to produce high-precision circuit substrates, DPC processes are used to create three-dimensional circuit substrates, and additive manufacturing technology is utilized to fabricate ceramic circuit boards.

▲ Scenes from previous events

Currently, the domestic ceramic substrate industry still faces a significant technological gap compared to leading international companies. Critical "bottleneck" materials such as high-quality powders, high-end oxygen-free copper strip materials, and AMB solder still rely on imports. Additionally, issues such as complex production processes, low quality yield rates, and high costs hinder development. To strengthen the communication and linkage between upstream and downstream in the ceramic substrate and packaging industry, Aibang Zhizao will host the "Fifth Ceramic Substrate and Packaging Industry Forum" in Suzhou on June 12, 2025. The discussions at this forum will focus on the raw material technologies, molding technologies, processing techniques, surface treatment technologies, metallization technologies, and testing technologies of high-performance ceramic substrates such as alumina, zirconia-toughened alumina, aluminum nitride, and silicon nitride. The forum will also cover the latest research developments, future trends, and application prospects of ceramic substrates and packaging. We sincerely invite friends from all parts of the industry chain to join the exchange and contribute to the development of the industry.