1. Background
As AI computing chips evolve towards larger sizes and higher integration, traditional packaging substrates are gradually approaching their physical limits. Glass substrates have become the preferred carrier for giants such as TSMC and Intel to deploy advanced packaging technologies such as CoWoS and HBM, thanks to their advantages such as lower signal loss and higher dimensional stability.
On March 19-20, Aibang Semiconductor held the 2025 Glass Substrate TGV Industry Chain Summit Forum in Suzhou. More than 600 experts, scholars and relevant personnel from well-known companies, research institutes, associations and other institutions in the industry participated in the discussion, and 20 industry leaders gave wonderful speeches. The two-day forum speeches were packed, the exchanges at the on-site booths were as heated as boiling water, and the sparks of thought continued to burst out in the warm atmosphere.
When the forum was about to end, nearly 2/3 of the participants were still there, and everyone was still eager to learn more. From this forum, it was enough to feel that everyone had a strong interest in the glass substrate TGV industry and was looking forward to the development prospects of the industry.
In order to continuously promote the development of the industry, promote upstream and downstream exchanges, and jointly explore market opportunities, Abang Semiconductor will hold the 2nd Glass Substrate TGV Industry Chain Summit Forum at the Shenzhen Bao'an International Convention and Exhibition Center from August 26 to 27, 2025, and will also hold the 2025 Glass Substrate and Packaging Industry Chain Exhibition at the same time.
Organizers:
Shenzhen Aibang Intelligent Manufacturing Information Co., Ltd.
Website: www.ab-sm.com
Time:August 26-27, 2025
Location: Hall 7, Shenzhen Baoan International Convention and Exhibition Center
2. Agenda (TBD)
| 8月26号（玻璃基板TGV） August 26 (Glass Substrate TGV) |
|
| 议题Topic | 演讲嘉宾 Speaker |
| 玻璃芯基板:新一代先进的封装技术 Glass core substrate: a new generation of advanced packaging technology |
安捷利美维电子（厦门）有限责任公司 技术专家 黄双武教授 Professor Huang Shuangwu, Technical Expert, AKM Meadville Electronics (Xiamen) Co., Ltd. |
| TGV集成三维互联核心材料技术 TGV integrated three-dimensional interconnected core material technology |
华中科技大学温州先进制造研究院 李运钧 研究员 Li Yunjun, Research Fellow, Wenzhou Institute of Advanced Manufacturing, Huazhong University of Science and Technology |
| 议题拟定中 Topic is being formulated |
江苏芯德半导体科技股份有限公司 研发副总经理 张中 Zhang Zhong, Deputy General Manager of R&D, Jiangsu Silicon Integrity Semiconductor Technology Co.,Ltd. |
| 先进封装的下一步：玻璃芯基板为何崛起 Next in Advanced Packaging: Why Glass Core Substrates is emerging |
YOLE Dr. Bilal HACHEMI |
| 玻璃基板原材料的技术及其应用 Technology and application of glass substrate raw materials |
拓科达科技(深圳)有限公司/NEG 日本电气硝子 技术总监 蔡岱峯 Shenzhen takoda Co.,Ltd. /Nippon Electric Glass Co., Ltd. Cai Daifeng, Technical Director |
| 中午休息 Noon break |
|
| TGV３.０通孔结构控制和金属化协同驱动封装新突破 TGV3.0's through-hole structure control and metallization synergistically drive new breakthroughs in packaging |
三叠纪（广东）科技有限公司 研发总监 李文磊 R&D Director Li Wenlei 3D CHIPS(GUANGDONG)TECHNOLOGY CO.,LTD |
| 基于SLE(选择性激光蚀刻)工艺的精密玻璃加工——机遇、挑战与解决方案 Precision Glass Processing Based on SLE (Selective Laser Etching) Process——Opportunities, Challenges and Solutions |
Workshop of Photonics/凌云光技术股份有限公司 （VP of Business Development and Innovation） Martynas Dagys Workshop of Photonics（VP of Business Development and Innovation） Martynas Dagys |
| TGV导电互连全湿法制备技术 TGV conductive interconnection full wet process preparation technology |
深圳大学 教授 符显珠 Shenzhen University Professor Fu Xianzhu |
| 磁控溅射深孔镀膜在TGV领域的应用 Application of Thin Film Deposition Technology in TGV Manufacturing |
广东汇成真空科技股份有限公司 项目经理 吴历清 Guangdong Huicheng Vacuum Technology Co., Ltd. Project Manager Wu Liqing |
| 基于Holotomography（HT）的玻璃基板三维无损检测与良率提升策略 Three-dimensional non-destructive testing and yield improvement strategy for glass substrates based on Holotomography (HT) |
韩国Tomocube 销售经理 金泳周 Kim Young-joo, Sales Manager of Tomocube Korea |
| 基于微镜阵列的超高速变焦显微成像技术在TGV产业的应用 Application of ultra-high-speed zoom microscopy technology based on micromirror array in TGV industry |
季华实验室/广东佛山超聚锐视科技有限公司 特聘研究员 金哲镐 博士 Dr. Jin Zhehao, Distinguished Researcher at Jihua Laboratory/Guangdong Foshan Chaoju Ruishi Technology Co., Ltd. |
| 玻璃基板封装关键工艺研究 Research on key processes of glass substrate packaging |
中科岛晶 产品经理 徐椿景 Product Manager of Hefei Zhongkedaojing Technology Co., Ltd. Xu Chunjing |
| 8月27号（板级封装） August 27 (board-level packaging) |
|
| 面向大算力应用的硅基光电融合先进封装技术 Silicon-based optoelectronic fusion advanced packaging technology for high-computing power applications |
刘丰满 博士 华进半导体封装先导技术研发中心有限公司 副总经理 Dr. Liu Fengman, Deputy General Manager,National Center for Advanced Packaging Co., Ltd. |
| 应用于三维封装的PVD 系统 PVD systems for 3D packaging |
深圳市矩阵多元科技有限公司 董事长 张晓军 Arrayed Materials (China) Co., Ltd.Chairman Zhang Xiaojun |
| 化圆为方：面板级封(PLP)实现异构集成芯未来 Squaring the circle: Panel-level packaging (PLP) realizes the future of heterogeneous integrated chips |
亚智系统科技（苏州）有限公司 Manz亚智科技事业开发部副总经理 简伟铨 Adam Adam Jian, Deputy General Manager of Business Development Department, Manz China Suzhou Ltd. |
| Evatec先进封装基板FOPLP刻蚀和溅射方案 Evatec Advanced Packaging Substrate FOPLP Etching and Sputtering Solutions |
Evatec China 技术市场总监 陆原博士 Evatec China Technical Marketing Director Dr. Lu Yuan |
| 蓝宝石晶体材料在半导体先进制程领域的应用 Application of sapphire crystal materials in advanced semiconductor manufacturing processes |
天通银厦新材料有限公司 副总经理 康森 Kang Sen, Deputy General Manager of Tiantong Yinxia New Materials Co., Ltd. |
| 中午休息 Noon break |
|
| FOPLP应用工艺可靠性挑战及封装板级协同设计解决方案 FOPLP application process reliability challenges and packaging board-level collaborative design solutions |
上海艾为电子技术股份有限公司 芯片封装首席专家 史洪宾 博士 Dr. Shi Hongbin Chief Chip Packaging Expert, Shanghai Awinic Technology Co., Ltd |
| 高精度非接触测量机在玻璃基板以及ABF载板行业中的应用 Application of high-precision non-contact measuring machines in glass substrate and ABF substrate industry |
Mitutoyo/三丰精密量仪（上海）有限公司 营业技术部部长 李斌 Li Bin, Director of Sales and Technology Department, Mitutoyo (Shanghai) Co., Ltd. |
| 涂布、干燥、贴膜工艺设备于玻璃基板及扇出型封装的应用趋势与挑战 Application trends and challenges of coating, drying and laminating process equipment in glass substrates and fan-out packaging |
群翊工業 李志宏 副總经理 Li Zhihong, Deputy General Manager GROUP UP INDUSTRIAL CO., LTD |
| TGV&PLP封装中的聚合物材料以及国产化前景 Polymer materials in TGV&PLP packaging and prospects for localization |
深圳先进电子材料国际创新研究院 研发工程师 林志强博士 Dr. Zhiqiang Lin, R&D Engineer, Shenzhen Institute of Advanced Electronic Materials |
| EDA 加速玻璃基器件设计与应用 EDA accelerates the design and application of glass-based devices |
芯和半导体科技（上海）股份有限公司 黄晓波 博士 Dr. Huang Xiaobo, Xpeedic (Shanghai) Co., Ltd. |
| 议题拟定中 Topic is being formulated |
天芯互联科技有限公司 器件产品线总监 宋关强 Song Guanqiang, Director of Device Product Line, SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. |
| 议题持续更新中 More topics are being recruited |
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3.Feedback Channel:
The final agenda and list of speakers will be updated in the near future and on the day of the conference. If you are interested in participating as a speaker or exhibitor at the 2nd TGV Forum, or if you are interested in opportunities for sponsorship, advertising, article submissions, conducting interviews, or if you have leading technology or product solutions, please contact Rongrong via email at lirongrong@aibang.com, Additional contact number: +8618823755657, or add Rongrong on WeChat: aibang360040.
