1. Background
The rapid development of advanced packaging and board-level packaging technologies is mainly due to the explosive growth in computing power demand, the inevitable choice in the post-Moore's Law era, and clear market growth expectations. In 2024, the global advanced packaging market reached $51.3 billion (accounting for nearly 50% of the overall packaging market), and is projected to grow to $91.1 billion by 2030, with a compound annual growth rate (CAGR) of approximately 10%. Board-level packaging (PLP), as an important direction within this market, has vast potential for substitution.
Photo taken at Yicheng Technology
Panel-level packaging (PLP) is an attractive branch of advanced packaging, its core value lying in its significant cost reduction potential, excellent electrothermal performance, and greater design flexibility: it facilitates heterogeneous integration, allowing chips from different process nodes and with different materials (such as CPUs, GPUs, and memory) to be integrated together to achieve better system-level performance.
High-end GPUs (such as NVIDIA and AMD series) and AI accelerator chips widely adopt 2.5D advanced packaging technologies such as TSMC's CoWoS. PLP is expected to provide more cost-effective solutions for these areas in the future. However, its development also faces some challenges, such as thermal stress management, TGV process complexity, and warpage issues with large panels.
Applications of Woger TGV in the semiconductor industry. (Image source: Woger Optoelectronics, Tongge Microelectronics)
However, with the collaboration of the industrial chain, technological innovation, the active deployment of various enterprises, and the acceleration of domestic substitution, the large-scale production of glass substrates may be promoted. It is expected that 2026 will become the "first year" of large-scale production of glass substrates, which will be applied first in high-end AI chips, data centers and other fields.
In order to continuously promote the development of the industry, promote upstream and downstream exchanges, and jointly explore market opportunities, Abang Semiconductor will hold the 3nd Glass Substrate TGV and Board-Level Packaging Industry Chain Summit Forum in Suzhou on March 19-20, 2026. We look forward to your participation and exchange.
Organizers:
Shenzhen Aibang Intelligent Manufacturing Information Co., Ltd.
Website: www.ab-sm.com
Time:March 19-20, 2026，Suzhou
2. Agenda
（Including but not limited to the following issues）
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第三届玻璃基板TGV产业链高峰论坛（2026年3月19-20日）苏州 The 3rd Glass Substrate TGV Industry Chain Summit Forum (March 19-20, 2026) Suzhou |
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序号NO. |
议题Topic |
演讲嘉宾Speaker |
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1 |
玻璃芯基板:新一代先进的封装技术 Glass core substrate: a new generation of advanced packaging technology |
安捷利美维电子（厦门）有限责任公司 AKM Meadville Electronics (Xiamen) Co., Ltd. |
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2 |
玻璃基板先进封装技术发展与展望 Development and Prospect of Advanced Packaging Technology for Glass Substrates |
玻芯成半导体科技有限公司 GlassMicro Semiconductor Technology Co., Ltd. |
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3 |
面向多芯粒异构先进封装的全玻璃多层互联叠构载板技术 All-glass multi-layer interconnect stacked substrate technology for multi-die heterogeneous advanced packaging |
沃格集团湖北通格微 Vogel Hubei tgvtech Co.Ltd. |
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4 |
多物理场仿真技术在玻璃基先进封装中的应用 Application of Multiphysics Simulation Technology in Glass-Based Advanced Packaging |
湖南越摩先进半导体有限公司 Hunan More Than Moore Advanced Semiconductor co., Ltd. |
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5 |
高密玻璃板级封装技术发展趋势 Development Trends of High-Density Glass Panel Packaging Technology |
成都奕成科技股份有限公司 Chengdu Echint Technology Co., Ltd. |
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6 |
TGV３.０通孔结构控制和金属化协同驱动封装新突破 TGV3.0's through-hole structure control and metallization synergistically drive new breakthroughs in packaging |
三叠纪（广东）科技有限公司 3D CHIPS（GUANGDONG）TECHNOLOGY CO.，LTD |
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7 |
面向大算力应用的硅基光电融合先进封装技术 Silicon-based optoelectronic fusion advanced packaging technology for high-computing power applications |
华进半导体封装先导技术研发中心有限公司 National Center for Advanced Packaging Co., Ltd. |
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8 |
TGV玻璃通孔激光加工中的基础问题和极限探究 Fundamental Problems and Limits in TGV Glass Through-Hole Laser Processing |
南方科技大学 Southern University of Science and Technology |
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9 |
玻璃基板光电合封技术 Challenges of optoelectronic sealing on glass substrates |
厦门云天半导体科技有限公司 Xiamen Sky Semiconductor Technology Co.Ltd. |
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10 |
EDA 加速玻璃基器件设计与应用 EDA accelerates the design and application of glass-based devices |
芯和半导体科技（上海）股份有限公司 Xpeedic (Shanghai) Co., Ltd. |
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11 |
高可靠3D IS(Integrated System)集成系统与3D IC先进封装关键技术研究 |
锐杰微科技 Rigger Micro Technologies |
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12 |
基于SLE(选择性激光蚀刻)工艺的精密玻璃加工——机遇、挑战与解决方案 Precision Glass Processing Based on SLE (Selective Laser Etching) Process——Opportunities, Challenges and Solutions |
Workshop of Photonics/凌云光技术股份有限公司 （VP of Business Development and Innovation） Martynas Dagys |
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13 |
应用于三维封装的PVD 系统 PVD systems for 3D packaging |
深圳市矩阵多元科技有限公司 Arrayed Materials (China) Co., Ltd. |
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14 |
化圆为方：面板级封(PLP)实现异构集成芯未来 Squaring the circle: Panel-level packaging (PLP) realizes the future of heterogeneous integrated chips |
亚智系统科技（苏州）有限公司 Manz China Suzhou Ltd. |
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15 |
议题待定 The topic is yet to be determined. |
3M中国有限公司 3M China Limited |
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16 |
Next in Advanced Packaging: Why Glass Core Substrates is emerging |
YOLE |
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17 |
先进封装对玻璃基板基材的要求 Requirements of advanced packaging for glass substrates |
征集中 Collection |
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18 |
无机玻璃材料的本构模型、破坏机理及其在工程中的应用 Constitutive models, failure mechanisms, and engineering applications of inorganic glass materials |
征集中 Collection |
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19 |
玻璃基互连技术助力先进封装产业升级 Glass-based interconnect technology helps upgrade the advanced packaging industry. |
征集中 Collection |
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20 |
玻璃芯板及玻璃封装基板技术 Glass core board and glass encapsulation substrate technology |
征集中 Collection |
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21 |
玻璃通孔结构控制、电磁特性与应用 Glass through-hole structure control, electromagnetic properties and applications |
征集中 Collection |
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22 |
如何打造产化的玻璃基板供应链 How to build a mass-producible glass substrate supply chain |
征集中 Collection |
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23 |
电镀设备在玻璃基板封装中的关键作用 The key role of electroplating equipment in glass substrate packaging |
征集中 Collection |
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24 |
玻璃基FCBGA封装基板 Glass-based FCBGA packaging substrate |
征集中 Collection |
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25 |
显微镜在半导体先进封装缺陷检测中的应用 Application of microscopes in defect detection of advanced semiconductor packaging |
征集中 Collection |
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26 |
在玻璃基板上开发湿化学铜金属化工艺 Developing a wet chemical copper metallization process on glass substrates |
征集中 Collection |
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27 |
异构封装中金属化互联面临的挑战 Challenges of Metallized Interconnects in Heterogeneous Packaging |
征集中 Collection |
更多相关议题征集中，演讲及赞助请联系李小姐：18823755657（同微信）
We are currently accepting submissions for more related topics. For speaking engagements and sponsorship inquiries, please contact Ms. Li: 18823755657 (same as WeChat).
3.Feedback Channel:
The final agenda and list of speakers will be updated in the near future and on the day of the conference. If you are interested in participating as a speaker or exhibitor at the 3nd TGV Forum, or if you are interested in opportunities for sponsorship, advertising, article submissions, conducting interviews, or if you have leading technology or product solutions, please contact Rongrong via email at lirongrong@aibang.com, Additional contact number: +8618823755657, or add Rongrong on WeChat: aibang360040.
