1. Background

As Moore's Law gradually approaches its physical limits, advanced packaging has become a critical path for sustaining semiconductor performance improvements and enabling system integration. TGV (Through Glass Via) technology, leveraging the excellent electrical insulation, low dielectric loss, tunable coefficient of thermal expansion, and easy availability of large-area ultra-thin glass substrates, is moving from the laboratory to industrial application and is widely regarded as a key enabler for next-generation high-performance chip packaging.

Intel's first EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging solution featuring a glass core substrate

Over the past year, TGV technology has achieved substantial breakthroughs globally. On the process front, laser-induced deep etching (LIDE) technology has matured further, with via aspect ratios evolving from the mass-production level of 10:1 toward 20:1 and beyond. In seed layer deposition, advanced PVD techniques such as HIPIMS and FCVA have made significant progress in conformal coverage for high-aspect-ratio vias. In metallization filling, conventional electroplating and emerging copper paste routes are advancing in parallel, steadily improving process efficiency and reliability. On the industrialization front, Intel publicly demonstrated a 10-2-10 thick glass core substrate combined with EMIB in early 2026, with plans to begin mass production within the year. TSMC’s CoPoS technology is progressing steadily, with volume production expected between the end of 2028 and early 2029. Samsung Electro-Mechanics has transferred its glass substrate project from R&D to its business division, significantly accelerating commercialization. Domestically, companies such as WG Tech, TianSemi, TriLima, BOE, and Glassix have built pilot or mass-production lines, with some products entering batch sampling. The initial industrial ecosystem is taking shape.

2.5D TGV high-density interposer – Photo taken at TianSemi’s booth, Semicon 2026

Customized glass-based semiconductor products – Photo taken at Glassix’s booth, the 3rd Glass Substrate Forum organized by Aibang

Downstream application demand is the core driver for the continued evolution of TGV technology. Sectors such as AI computing chips, high-performance computing, CPO optical modules, 5G/6G communications, and Mini/Micro LED displays have an increasingly urgent need for high-density, low-loss, large-area packaging, providing a broad market space for glass substrates. According to industry research forecasts, the Chinese TGV packaging solutions market will exceed RMB 390 million in 2026, representing year-on-year growth of over 50%.

Application scenarios of glass substrates – Photo taken at Tongwei Micro’s booth, Semicon 2026

Co-packaged optics (CPO) – Photo taken at TriLima’s booth, Semicon 2026

Of course, we are fully aware that large-scale industrialization of TGV technology still faces many challenges. The brittleness of glass, uniformity in high-aspect-ratio via processing, conformal seed layer deposition, reliability of electroplated filling, as well as warpage control and inspection efficiency for large panels, are key bottlenecks limiting yield and cost. In addition, the localization of high-end equipment and certain materials is still a work in progress, and collaborative innovation across the upstream and downstream supply chains urgently needs to be strengthened.

To this end, Aibang Semiconductor will hold the 4th Glass Substrate and Advanced Packaging Industry Chain Summit Forum on August 26–28, 2026, at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall, Hall 7). The forum aims to build an open and professional exchange platform, bringing together experts and corporate representatives from materials, equipment, manufacturing, packaging, and application sectors to discuss the latest advances, process challenges, market trends, and collaborative pathways for the TGV technology industry chain. We look forward to fostering close upstream-downstream cooperation through in-depth technical sharing and industry dialogue, accelerating the maturation and commercial deployment of TGV technology.

Organizers:

Shenzhen Aibang Intelligent Manufacturing Information Co., Ltd.

Website: www.ab-sm.com

Time:August 26-28, 2026

Location: Hall 7, Shenzhen Baoan International Convention and Exhibition Center

2. Agenda

3.Feedback Channel:

The final agenda and list of speakers will be updated in the near future and on the day of the conference. If you are interested in participating as a speaker or exhibitor at the 4nd TGV Forum, or if you are interested in opportunities for sponsorship, advertising, article submissions, conducting interviews, or if you have leading technology or product solutions, please contact Rongrong via email at lirongrong@aibang.com, Additional contact number: +8618823755657, or add Rongrong on WeChat: aibang360040.

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