陶瓷基板暨功率半导体产业论坛
Ceramic Substrate and Power Semiconductor Industry Forum
2026年8月26日 10:00-16:40
深圳国际会展中心宝安新馆7号馆 论坛区3
1
演讲议题
|
The 6th Ceramic Substrates and Power Semiconductors Industry Forum |
||
|
|
||
|
|
Thematic Report |
Guest speaker |
|
|
Innovative Embedded Packaging Technology Based on DAB Ceramic Substrates |
Liu Heng Minister of Strategic Planning Department,Jiangsu Ferrotec Semiconductor Technology Co., Ltd. |
|
|
Silver-Free Active Metal Brazing (AMB) Copper-Clad Ceramic Substrates for High-Voltage Power Modules: Material Innovation and Reliability Study |
Chen Tianhua Deputy General Manager, Hexcera |
|
|
Application of Laser Precision Machining and Welding Processes in High-Reliability Power Device Packaging |
Zhao Jiantao General Manager,Vi Laser Intelligent Equipment Co., Ltd. |
|
|
Application of Defect Inspection in Precision Ceramic Manufacturing Processes |
Liu Weisheng Deputy General Manager Shenzhen Heils Union Technology Co., Ltd. |
|
|
Silicon Nitride Powder Project via Ammonolysis Method |
Liu Zaixiang General Manager Qingdao Qiaohai Ceramic New Material Technology Co., Ltd. |
|
|
Key Technologies and Innovative Applications of DPC Ceramic Substrates for Advanced Packaging |
Wu Zhaohui General Manager,Jiangxi Lattice Grand Advanced Material Technology Co., Ltd. |
|
|
|
|
|
|
Application of PVD Technology on Ceramic Substrates for Packaging |
Xie Bin Professor University of Science and Technology of China (USTC) |
|
|
AlN material one-stop solution —— Chengdu Xuwxin New Materials, empowering high-end manufacturing |
Jiang Min Deputy General Manager / Sales Director Chengdu Xuci New Materials Co., Ltd./Ningxia Beici New Material Technology Co., Ltd. |
|
|
Leading the Comprehensive Innovative Application of High-Reliability Silicon Nitride Copper-Clad Substrates in New Energy Vehicles, PV Energy Storage, and Industrial Power Modules |
Zhou Xin, General Manager, NANTONG WINSPOWER SEMICONDUCTOR TECHNOLOGY CO., LTD |
|
|
Positioning for Domestic Substitution: Mass Production Value and Application Prospects of 92% Alumina Ceramic Substrates |
Pan Zimei Engineer Guangdong Ciyuan Chuangxin Semiconductor Co., Ltd. |
|
|
Discussion on the Application of Silver-Coated Copper in Silver Paste for Chip Interconnection |
Li Minggang Professor Central South University |
|
|
|
|
|
|
Research Progress on the Structure of IGBT Devices |
Zhang Jinping Professor University of Electronic Science and Technology of China (UESTC) |
|
|
Application of Magnetron Sputtering Deep Hole Coating on Ceramic Substrates |
Guangdong Huicheng Vacuum Technology Co.,Ltd |
|
|
Industrialization Progress and Applications of High-Thermal-Conductivity Ceramic Substrates |
Xiang Peng Deputy General Manager & Chief Engineer Yibin Red-star Electronics Co., Ltd. |
|
|
High-Reliability DBA Substrate for SiC Chip Packaging |
Liang Chao Deputy General Manager Jiangsu Bree Optronics Co., Ltd. |
|
|
Topic To Be Confirmed |
KBC Corporation Ltd. |
长按二维码扫码在线登记报名
或者复制网址到浏览器后，微信注册报名：https://www.aibang360.com/m/100308
温小姐：18126443075（同微信）
邮箱：wenxiaoting@aibang.com
扫码添加微信，咨询展会详情
2026-07-28
2026-07-24
观众登记已开启，点击阅读原文，即可免费参观！
陶瓷基板相关资料下载：
成员: 5306人， 热度: 153517
陶瓷 天线 通讯 终端 汽车配件 滤波器 电子陶瓷 LTCC MLCC HTCC DBC AMB DPC 厚膜基板 氧化铝粉体 氮化铝粉体 氮化硅粉体 碳化硅粉体 氧化铍粉体 粉体 生瓷带 陶瓷基板 氧化铝基板 切割机 线路板 铜材 氮化铝基板 氧化铍基板 碳化硅基板 氮化硅基板 玻璃粉 集成电路 镀膜设备 靶材 电子元件 封装 传感器 导电材料 电子浆料 划片机 稀土氧化物 耐火材料 电感 电容 电镀 电镀设备 电镀加工 代工 等离子设备 贴片 耗材 网版 自动化 烧结炉 流延机 磨抛设备 曝光显影 砂磨机 打孔机 激光设备 印刷机 包装机 叠层机 检测设备 设备配件 添加剂 薄膜 材料 粘合剂 高校研究所 清洗 二氧化钛 贸易 设备 代理 其他 LED
应用终端 SIC IGBT模块 SIC模块 碳化硅衬底 IGBT芯片 分立器件 材料 焊接材料 真空回流焊炉 烧结银 烧银炉 烧结炉 陶瓷基板 铜底板 焊接设备 划片机 晶圆贴片机 灌胶机 贴片 表面处理 硅凝胶 环氧树脂 散热器 铝碳化硅 五金 键合机 键合丝 超声焊接机 陶瓷劈刀 激光设备 设备配件 PVD设备 ALD 电子浆料 CVD 导热材料 元器件 密封胶 X-Ray 配件 超声波扫描显微镜 塑胶外壳 玻璃 塑料 线路板 设备 散热材料 热敏电阻 点胶机 胶水 自动化设备 运动控制 封装设备 检测设备 认证检测 夹治具 清洗设备 测试设备 磨抛耗材 磨抛设备 代理 贸易 其他