针对玻璃脆性材料加工易产生微裂纹、侧壁粗糙、垂直度偏差等行业共性技术痛点，利元亨采用激光诱导改性结合湿法腐蚀的工艺路线。通过精准调控激光脉冲能量、作用时间与扫描路径，在玻璃内部形成连续均匀的改性区，经后续湿法腐蚀后生成内壁光滑、垂直度优异的通孔，有效保障了加工质量与后续信号传输的可靠性。
利元亨TGV玻璃通孔激光设备集成红外飞秒激光器、贝塞尔光束聚焦系统、高精度真空吸附治具等核心配置，最大能兼容510mm×515mm大尺寸玻璃基板，在万级洁净室环境下稳定运行，可为客户提供从工艺研发、参数优化到小批量试产的全流程技术支持。
未来，利元亨将继续坚守 "技术立业" 初心，持续加大研发投入，深化与产业链上下游的协同创新，为我国先进封装产业的高质量发展贡献力量。
Technology as Foundation | Lyric's Through Glass Via (TGV) Laser Equipment Enables Breakthroughs in Domestic Advanced Packaging As the demands for training and inference of AI large scale models grow exponentially, the computing power density of chips keeps rising. Conventional organic packaging substrates can no longer meet the stringent requirements for high frequency and high speed signal transmission, high density interconnection and high efficiency heat dissipation. Against this backdrop, advanced packaging technology has become a core pathway to sustain improvements in chip performance. As a critical bottleneck for the industrial implementation of glass substrates, Through Glass Via (TGV) technology serves as the core enabler for high speed vertical interconnection between chips. Leveraging its profound expertise in precision laser processing and motion control, Lyric has successfully overcome core technical challenges such as ultrafast laser energy control, high-precision trajectory tracking, and glass material modification control. Its independently developed TGV laser equipment provides critical equipment support for the development of domestic advanced packaging technology. Lyric TGV Laser Equipment integrates multiple cutting‑edge technologies to achieve coordinated improvements in processing accuracy, efficiency and material compatibility. Equipped with an industry‑leading ultrafast laser system, it adopts a collaborative architecture of fixed optical path and high‑precision motion platform. Its positioning accuracy is strictly controlled within ±1.3 μm. It can stably adapt to glass substrates with a full thickness range from 0.05 mm to 2.1 mm, and processing dimensions can be customized to meet customers’ production‑line requirements. To address common industry technical pain points in the processing of brittle glass materials, such as microcracks, rough sidewalls, and perpendicularity deviations, Lyric adopts a process route that combines laser-induced modification with wet etching. By precisely controlling laser pulse energy, duration, and scanning path, a continuous and uniform modified zone is formed inside the glass. Subsequent wet etching produces through-holes with smooth inner walls and excellent perpendicularity, effectively ensuring processing quality and the reliability of subsequent signal transmission. Lyric's TGV laser equipment integrates core configurations such as an infrared femtosecond laser, a Bessel beam focusing system, and a high-precision vacuum adsorption fixture. It is compatible with large-size glass substrates up to 510 mm × 515 mm and operates stably in a Class 10,000 cleanroom environment. It provides customers with end-to-end technical support, covering process development, parameter optimization, and small-batch trial production. In the future, Lyric will continue to uphold its original aspiration of "Technology as the Foundation," continue to increase R&D investment, deepen collaborative innovation with upstream and downstream partners in the industrial chain, and contribute to the high-quality development of China's advanced packaging industry.
一颗芯片的制造工艺非常复杂，需经过几千道工序，加工的每个阶段都面临难点。欢迎加入艾邦半导体产业微信群：
长按识别二维码关注公众号，点击下方菜单栏左侧“微信群”，申请加入群聊
