1月8日，三星电机首席执行官张德贤在美国拉斯维加斯安可酒店召开新闻发布会，公布了公司对未来新业务的计划。这些计划统称为“Mi-RAE”，涵盖移动行业、机器人、人工智能服务器和能源领域。
8日(当地时间)三星电机总经理张德贤在美国拉斯维加斯举行的记者招待会上，正在对玻璃基板进行说明。（图源：美洲中央日报）
在半导体玻璃基板方面，经过与客户协商，目标是2027年以后批量生产。张社长表示：“具体虽然不能提及客户，但已经有多个客户询问，今年将与客户一起进行样品测试。计划将连接半导体和电子部件的基板从原来的塑料材料改为玻璃的玻璃基板，具有实现薄微电路的优势。”
还补充道，“今年我们将向两到三个客户提供样品。”该公司正在其世宗工厂建立一条玻璃基板试验线，并加速研发 (R&D) 工作。
注：图片和内容来源于美洲中央日报，文章仅供参考，如涉及到侵权等问题，请联系小编删除https://news.koreadaily.com/2025/01/09/economy/economygeneral/20250109003508824.html
艾邦建有玻璃基板与TGV技术交流群，可以加强产业链的合作，促成各企业的需求对接，同时您也可以与行业精英共同探讨玻璃基板及TGV技术的前沿动态，共享资源，交流经验，欢迎您的加入。
活动推荐：
|
Topic |
Companies to be invited |
|
Challenges and solutions of TGV glass core technology |
Guangdong Fozhixin Microelectronics Technology Research Co., LTD |
|
Difficulties in the production of TGV metal lines and their technical solutions |
Hubei TGVTECH Co., Ltd. |
|
Glass core substrate: a new generation of advanced packaging technology |
AKM Meadville Electronics (Xiamen) Co. Ltd. |
|
The latest generation of TGV technology and applications |
3D CHIPS (GUANGDONG) TECHNOLOGYCO.,LTD |
|
SCHOTT glass enables advanced packaging |
SCHOTT Group |
|
Application of microscope in semiconductor advanced packaging defect detection |
Guangdong Huipuguangxue Technology Co., Ltd. |
|
Prospects for the application of through-glass technology in advanced packaging |
Xiamen Sky Semiconductor Technology Co.Ltd. |
|
Discussion on the filling technology of through-hole in glass substrate |
Guangdong Tiancheng Technology Co., Ltd. |
|
Laser-induced deep etching technology is used to realize the processing of glass substrates with integrated multi-functional structures |
乐普科 中国区 |
|
Design, development and application of high-performance IPD based on TGV |
ShangHai Xpeedic Co., Ltd. |
|
Application of Multi-physics Simulation Technology in Glass-based Advanced Packaging |
Hunan More Than Moore Advanced Semiconductor Co.,Ltd. |
|
High-density glass-level packaging and heterogeneous integration process development challenges and solutions |
Chengdu ECHINT Technology Co., Ltd. |
|
Application of PVD equipment in deep hole coating in TGV technology |
Guangdong Huicheng Vacuum Technology Co., Ltd. |
|
From round to square: Evatec's advanced packaging substrate FOPLP etching and sputtering solutions |
Evatec China |
|
The latest progress and future prospects of glass substrate packaging technology |
Shenzhen Fanxin Integrated Semiconductor Co., Ltd. |
|
Innovative technologies and applications of glass substrates: from plasma vias to surface modification and metal seed layer technology |
UVAT Technology co.,Ltd. |
|
Panel level laser induced etching & AOI |
Shenzhen GH LASER Co., Ltd. |
|
Integrated passive on glass substrate |
SUzhou senwan Electronic Technology Co., Ltd. |
|
玻璃基板量产线 铜线路蚀刻工艺 |
广州市巨龙印制板设备有限公司 |
|
用于TGV封装领域的光学量检测技术 |
北京电子量检测股份有限公司 |
李小姐：18823755657（同微信）
邮箱：lirongrong@aibang.com
https://www.aibang360.com/m/100235?ref=100042
原文始发于微信公众号（艾邦半导体网）：三星：2027年将批量生产玻璃基板
English 
Chinese