第四届功率半导体论坛资料公开（PPT+视频）

Translation: As the application fields of power semiconductor devices continue to expand, the performance requirements for these devices are also becoming increasingly demanding. Therefore, the development of new packaging technologies is necessary to enhance the performance of power semiconductor devices. These include innovations in copper (or aluminum) ceramic substrates, heat dissipation substrates, encapsulation materials, and casing materials, as well as key technologies such as ultrasonic bonding, large-area silver sintering, and copper interconnects.

此次论坛可公开资料内容包括：

获取以上资料方式：①长按关注艾邦半导体公众号，②回复关键词“20250613”，即可领取查看！